As most of us know, football season began across America last month, with both college and the NFL seasons starting. With the recent moves by our Federal Government, it seems they have a bit of a football game strategy when it comes to the semiconductor market segment.
What is the meaning of the word “interconnect”? As the word is applied in the field of electronics, interconnect, as defined at Techopedia.com, defines the word as follows. “An interconnect (generally speaking) is a physical or logical connection between two electronic devices or networks.” Printed circuit boards (PCB) consisting of hundreds, sometimes, thousands, of interconnected integrated circuits (IC) and other active and passive devices are essential in today’s electronic world.
To tell the story of Interconnect, we must go back in time to the printed circuit board (PCB) test industry prior to the year 1990. At that time, electronics manufacturers relied upon a hands-on approach to test PCBs for structural integrity.
The CHIPS Act as a byproduct will create a fantastic opportunity for high-paying semiconductor test, design-for-test and validation engineering jobs for America.
Cyber attackers use Rootkits to implant malware using Operating System internals. Bootkits are for more persistent implants, targeted toward UEFI firmware vulnerabilities. But, what if you go lower down, into the silicon? This is a Chipkit.
Our new SourcePoint Intel release, 7.12.22, is now in production and available to all subscribers. Our most polished, fully-featured release yet, it adds the following features:
It’s probably not well-known, but AMD platforms have special low-level breakpoint capabilities that aren’t available on Intel platforms. They are extremely powerful; here’s how to use them.
If you want to learn about UEFI, you have to be able to see the source code and debug it. Here’s how to build a debug Tianocore image on the AAEON UP Xtreme Whiskey Lake board, flash it onto the target, and use SourcePoint to debug it with Intel Direct Connect Interface (DCI).