Category: Intel® IBIST

I was reflecting on how much processor speeds, memory, and data transmission rates have increased over the last few decades. And yet the same old tools and techniques are often used to bring up new designs. When do you think we fall off the cliff?
Board bring up of an early prototype is one of the most important steps for a design team. The first boards must pass through a battery of tests to demonstrate that the hardware is rock-solid. Non-intrusive technologies can be used to accelerate this process.
Today I read an interesting article in Electronic Design magazine about the complexity of testing third-generation serial-data technology. With comments from Agilent, Tektronix and LeCroy, the article highlights all of the problems associated with oscilloscopes, BERTs, AWGs and other “heavy-metal” products, and not surprisingly doesn’t say anything about the elegant alternative of using embedded instrumentation…
Tired of that old bed-of-nails? Legacy In-Circuit Test (ICT) has been diminishing in value for a long time. Let’s explore some of the current technical issues with ICT as test access on new circuit board designs continues to disappear.
Those of you with a telecom background are no doubt aware of the “OSI Network Model”, also known as the OSI pyramid or stack. It is a way of sub-dividing a communications system into smaller parts called layers. A layer is a collection of similar functions that provide services to the layer above it and receives services from the layer below it. A decade ago, the telecommunications test industry underwent a revolution when platforms emerged that could cover multiple layers of the OSI stack. Now, the same thing is happening in the circuit board test industry...
It is a well-known fact that manufacturing test strategies must involve a combination of inspection, structural, and functional test technologies in order to yield highest quality and minimize customer returns. But a new breed of non-intrusive, software-based technologies promises to disrupt legacy test solutions by guaranteeing the highest test coverage at the lowest cost. These technologies leverage off of the embedded instruments within silicon to achieve this goal in the following ways...
The world of validation has changed dramatically over the last few years due to the added challenge of increasing bus speeds. My observation across the industry is there are two camps companies are aligning on...
Ircona, a company specializing in high-speed processor-based designs and BIOS customization for partners including Phoenix Technologies, has recently used our Intel® Interconnect Built-In Self Test (IBIST) tool to troubleshoot some very elusive signal integrity issues on a high-end server design...
For those working with the new Intel® QuickPath Interconnect (QPI) high speed bus, there's a new book on the market called “Mastering High Performance Multiprocessor Signaling” by Dave Coleman and Michael Mirmak. This will become the "Bible" on high speed buses. Here are the details...
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