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Arranged by category – Software Debug, Chip Debug, Hardware Validation, Manufacturing Test and Videos – these are some of our trending eBooks and videos. But there’s more, much more. Our experts are constantly working on new resources to help you. Click on the “More” buttons in each category to take a deeper dive.

Guidelines for Board Design for Test (DFT) based on Boundary Scan – Volume 2

Advanced guidelines for board design for test (DFT) based on Boundary Scan with a focus on structural memory tests, flash programming, and FPGA configuration.

Guidelines for Board Design for Test (DFT) based on Boundary Scan – Volume 1

DDR Memory Test: Modern Tools for Validation, Test and Debug

IEEE 1149.1 JTAG and Boundary Scan Tutorial | Second Edition

UEFI Framework Debugging | SourcePoint

Spending too much time trying to navigate the growing UEFI code base or debugging UEFI code after you have inserted your module?

Guide to Intel Debug and Trace - 2022 Edition

The MinnowBoard Chronicles

Intel Trace Hub | Faster Software Debug | Finding Root Cause

Chiplet Interconnect Testing Using JTAG/Boundary Scan

Chiplet-based multi-die devices, as products of a heterogenous integration design methodology, play an important role in today’s chip design and implementation strategies. The drive to implement multi-die devices began in the 1970’s with a packaging innovation approach consisting of placing multiple interconnected chips on a package-scale substrate. These devices became known as multi-chip modules (MCMs). Over time, additional packaging innovations emerged such as System in a Package (SiP), System on Integrated Chip (SoIC)™, 2.5D-Integrated Circuits (ICs) and 3D-IC packages. Multi-die packaging innovations has allowed the semiconductor industry to create smaller, faster, configurable, and lower power ICs.

IEEE 1687 IJTAG | The Future of Embedded Instruments

Mixing Embedded eTAPs | 1149.1, IJTAG, Software Debug

IEEE 1687 IJTAG Tutorial | Third Edition

Data Mining Analytics for Serdes | HSIO Validation

One-shot pass/fail validation testing won’t quantify the risk of faults on serdes and high-speed I/O (HSIO) buses, but data mining with statistical analytic tools will. In fact, you’ll see how close the bus is relative to its eye mask and where those failures are just waiting to happen. Why risk the crashes, poor performance and dissatisfied users?

eResources

eResources

Manufacturing Test

Guidelines for Board Design for Test (DFT) based on Boundary Scan – Volume 2

Guidelines for Board Design for Test (DFT) based on Boundary Scan – Volume 1

DDR Memory Test: Modern Tools for Validation, Test and Debug

IEEE 1149.1 JTAG and Boundary Scan Tutorial | Second Edition

Software Debug

UEFI Framework Debugging | SourcePoint

Guide to Intel Debug and Trace - 2022 Edition

The MinnowBoard Chronicles

Intel Trace Hub | Faster Software Debug | Finding Root Cause

Chip Debug

Chiplet Interconnect Testing Using JTAG/Boundary Scan

IEEE 1687 IJTAG | The Future of Embedded Instruments

Mixing Embedded eTAPs | 1149.1, IJTAG, Software Debug

IEEE 1687 IJTAG Tutorial | Third Edition

Hardware Validation

Data Mining Analytics for Serdes | HSIO Validation

Signal Integrity Validation Procedure for Intel® Core™ Platforms

Intel® Microarchitecture Code Name Haswell Application Using ScanWorks®

Signal Integrity Validation Procedure for Intel® Xeon® Platforms