Arranged by category – Software Debug, Chip Debug, Hardware Validation, Manufacturing Test and Videos – these are some of our trending eBooks and videos. But there’s more, much more. Our experts are constantly working on new resources to help you. Click on the “More” buttons in each category to take a deeper dive.

Manufacturing Test

ScanWorks users can bridge the coverage gap between boundary scan and functional test via its Component action. This action allows for testing of non-boundary scan devices, such as analog to digital converters (ADCs), digital to analog converters (DACs), Ethernet PHYs, LED, switches, clocks, and other non-boundary scan devices through the PCBs boundary scan infrastructure.

Software Debug

Chip Debug

Chiplet-based multi-die devices, as products of a heterogenous integration design methodology, play an important role in today’s chip design and implementation strategies. The drive to implement multi-die devices began in the 1970’s with a packaging innovation approach consisting of placing multiple interconnected chips on a package-scale substrate. These devices became known as multi-chip modules (MCMs). Over time, additional packaging innovations emerged such as System in a Package (SiP), System on Integrated Chip (SoIC)™, 2.5D-Integrated Circuits (ICs) and 3D-IC packages. Multi-die packaging innovations has allowed the semiconductor industry to create smaller, faster, configurable, and lower power ICs.

Hardware Validation

One-shot pass/fail validation testing won’t quantify the risk of faults on serdes and high-speed I/O (HSIO) buses, but data mining with statistical analytic tools will. In fact, you’ll see how close the bus is relative to its eye mask and where those failures are just waiting to happen. Why risk the crashes, poor performance and dissatisfied users?