Following a defined methodology is an essential step in ensuring signal integrity on Intel® Core™ designs. An approved three-phase process is as follows:

This document provides a detailed look at the use of boundary-scan test, processor-controlled test and high-speed I/O validation when applied to the Intel® microarchitecture code name Haswell design. In particular you will learn:

Following a defined methodology is an essential step in ensuring signal integrity on Intel® Xeon® designs. An approved three-phase process is as follows:

Designing sufficient operating margins into today’s high-speed printed circuit boards has become a very tough job. Especially challenging are those high-speed serial I/O and DDR3|DDR4 memory buses. Measuring signal integrity on a lane or two here and there won’t cut it anymore.

Remember test pads? Small contact points on a board’s interconnect buses with physical access for test purposes? No more. Or at least not for high-speed serial interconnects like PCI Express, Fibre Channel,10-Gbps Ethernet, InfiniBand®, Intel® QuickPath Interconnect (QPI) and the like.

Ever wonder why your notebook is running slower than ever, or keeps hanging and crashing? It could be signal integrity.

Validating prototype circuit boards gives you a level of confidence, but variances in manufacturing processes are just as likely to erode that confidence right along with the transfer speeds on high-speed serdes traces. Find out about the many causes of process variations, their effects and, most importantly, what you can do detect variances before they take a costly toll.

This document provides an overview of the use of boundary-scan test, processor-controlled test and high-speed I/O validation when applied to the Intel® microarchitecutre code name Haswell design.