One-shot pass/fail validation testing won’t quantify the risk of faults on serdes and high-speed I/O (HSIO) buses, but data mining with statistical analytic tools will. In fact, you’ll see how close the bus is relative to its eye mask and where those failures are just waiting to happen. Why risk the crashes, poor performance and dissatisfied users?

Designing sufficient operating margins into today’s high-speed printed circuit boards has become a very tough job. Especially challenging are those high-speed serial I/O and DDR3|DDR4 memory buses. Measuring signal integrity on a lane or two here and there won’t cut it anymore.

Remember test pads? Small contact points on a board’s interconnect buses with physical access for test purposes? No more. Or at least not for high-speed serial interconnects like PCI Express, Fibre Channel,10-Gbps Ethernet, InfiniBand®, Intel® QuickPath Interconnect (QPI) and the like.

Validating prototype circuit boards gives you a level of confidence, but variances in manufacturing processes are just as likely to erode that confidence right along with the transfer speeds on high-speed serdes traces. Find out about the many causes of process variations, their effects and, most importantly, what you can do detect variances before they take a costly toll.