Lead-free assembly shifts test methods toward boundary scan
by Dr. Ben Bennetts, DFT Consultant

Worldwide the move is on to eliminate pollution-causing lead from the printed circuit board manufacturing process. Already the European Union (EU) has banned lead from all electronic products as of July 2006. Japan followed suit soon thereafter. The US might not be far behind. The effects of ‘getting the lead out’ on electronic test and the use of JTAG test techniques will be far reaching.

Read more...

Frequently Asked Questions (FAQ): Embedded Instrumentation – The future of advanced design validation, test and debug

Media Fact Sheet – Embedded Instrumentation Gains Broad Traction Across the Electronics Industry

Media Fact Sheet – Embedded Instrumentation Comes in Many Shapes, Sizes and Flavors

Lead-free assembly shifts test methods toward boundary scan

Using Boundary Scan to Link Design and Manufacturing Test

Device Modeling Is Critical for Fast Time-to-Test

System Test with Boundary Scan (JTAG)

Fault Coverage Reporting

Boundary scan helps EMS companies cut test costs and increase revenues

Reptron Manufacturing Services – A white paper evaluating ASSET InterTech’s ScanWorks System

Agilent white paper on how ScanWorks has saved Lucent $1 million

Agilent white paper on Jabil’s evaluation of ScanWorks