ASSET InterTech's Boundary-Scan Test, Processor-Controlled Test and Intel® IBIST are unique tools for access, automation and analysis of embedded instrumentation.
Intel® Pentium® M
Intel® Xeon® (604 pin)
Processor-Controlled Test (PCT) can be connected to the Unit Under Test (UUT) in a variety of ways. If the UUT doesn't have an on-board JTAG header, but the CPU is socketed, an interposer can be placed between the CPU and socket to provide access to the JTAG lines. The standard JTAG header on the interposer is then connected to the processor control POD. For the most recent Intel® processors, a top-side probe must be used instead of an interposer (see below for more details).
Interposers are available for the following processors:
In some cases there is more than one interposer for a specific processor type, due to pin, package or core changes in later versions. For example, the Intel® Celeron® M can be based on Banias, Dothan, Yonah and Merom cores. This explains why it appears in the following interposer list a number of times. It is important to ensure that the correct interposer is selected. Please check the interposer specifications in the parts list below.
Top-side probes are available for the following processors:
In the case of Intel® Pentium® 4 and other processors that require an Intel®-specified Debug Port Adapter (DPA), this is provided with the PCT POD and is attached either directly to a JTAG header on the board under test, or to the header on the interposer (as shown) where no on-board header is provided.
Care should be taken when attaching the DPA: one of the pins on the header is cut off, and the corresponding hole in the DPA is blocked to ensure correct orientation.
The DPA is designed to connect to a 26-pin Intel®-specified ITP 700 header. However, adapters are available to allow the DPA to be connected to Intel®-specified ITP 700 Flex, eXtended Debug Port (XDP) and Second Side Attach (SSA) headers.
The XDP adapter (shown below) may need to be configured to ensure that the DPA receives the correct signals from the 60-pin XDP port. Please see Application Note #10 for full details.
Many recent Intel® processors, including Pentium® 4 and Xeon® processors, are designed to fit into Land Grid Array (LGA) sockets. These processors have flat pads, or lands instead of projecting pins. The LGA sockets contain pins that make contact with the processor lands. When a load plate is closed over the processor it applies a downwards force, which bends the socket pins slightly to ensure good contact. The LGA775 socket contains 775 pins (e.g. Pentium® 4) and the LGA771 contains 771 pins (e.g. Xeon®).
The LGA775 and LGA771 interposers consist of a CPU-shaped PCB that replaces the CPU in the socket on the board under test. This PCB breaks out the debug port signals onto a flexible cable, which terminates in an Intel®-specified XDP header. All other signals are passed through the PCB into a second LGA socket, in which the CPU is placed. This second socket, with the PCB soldered to its base, is loaded and depressed into the socket of the board under test by a stainless steel clamp (shown below). The heatsink and fan are mounted on top of this assembly.
This illustrated manual gives full details of the LGA interposers, and explains how to use them.
New Intel® CPUs with
top-side pads
Intel® Core™ i7 processors and the Intel® Xeon® processor 5500 series use LGA1366 sockets, similar in design to the LGA775/771 sockets. However, the high speeds of these processors mean that the use of an interposer between the socket and the CPU could interfere with signal integrity. Intel has therefore provided pads on the top side of the CPU, which mirror the required signals. To access these top-side pads, ASSET has developed a top-side probe.
The LGA1366 top-side probe consists of a PCB with a ring connector attached below it that contains small, spring-loaded probe tips. These tips make contact with the CPU's top-side pads, allowing the debug port signals to be broken out onto a flexible cable, which terminates in a small PCB carrying a Intel®-specified XDP header. The standard socket load mechanism is used above the probe's PCB to depress the CPU into its socket. The heatsink and fan are mounted onto a heatsink location plate supplied with the probe.
This illustrated manual gives full details of the LGA1366 top-side probe, and explains how to use it.
| Interposer | |
Order No. |
| Intel® Pentium® processor (PPGA) | 97139 | |
| Intel® Pentium® Pro™ processor | 97140 | |
| Intel® Pentium® II/III processor (Slot 1) | 97141 | |
| Intel® Pentium® II/III Xeon™ processor (Slot 2) | 97142 | |
| Intel® Pentium® II processor (MMC-1) | 97143 | |
| Intel® Pentium® II processor (MMC-2) | 97144 | |
| Intel® Pentium® III processor 1.5V FC-PGA (Coppermine, NOT Tualatin) / Intel® Celeron™ processor 2.5V PPGA & 1.5V FC-PGA (370 pin). | 97138 | |
| Intel® Pentium® III processor 1.5V FC-PGA (Coppermine) & 1.25V FC-PGA (Tualatin) / Intel® Celeron™ Processor 1.5V FC-PGA ONLY (370 pin). | 97145 | |
| Mobile Intel® Pentium® III Processor-M / Mobile Intel® Celeron™ Processor (478 pin) | 97146 | |
| Intel® Pentium® 4 processor FC-PGA (423 pin) | 97196 | |
| Intel® Pentium® 4 / Celeron® D processors - µFC-PGA (478 pin) | 206002 | |
| Mobile Intel® Pentium® 4 Processor-M (478 pin) | 97146 | |
| Intel® Pentium® M processor - Centrino™ / Celeron® M processors (478 pin) - Standard (header overhang on opposite side to pin 1). | 206003 | |
| Intel® Pentium® M processor - Centrino™ / Celeron® M processors (478 pin) - Reversed (header overhang adjacent to pin 1, allowing access to non-standard location of CPU clamping screw). | 206004 | |
Intel® Core™ / Core™ Solo / Core™ Duo / Core™2
Duo (A-Step) / Celeron® M processors based on the same core
(478 pin).
Processor pin layout viewed from below with the triangular "Pin
1" indicator at the bottom-right corner. |
97162 | |
Intel® Core™2 Duo (B-Step) / Celeron® M processors
based on the same core (478 pin). Processor
pin layout viewed from below with the triangular "Pin 1"
indicator at the bottom-right corner. |
97164 | |
| Intel® Xeon® processor - Sossaman (478 pin) | 97166 | |
| Intel® Xeon® processor INT-µPGA (603 pin) | 97135 | |
| Intel® Xeon® processor FC-µPGA2 (604 pin) | 97194 | |
| Intel® Xeon® processor (including Dual- and Quad-Core)
- LGA771socket (771 lands). See the LGA Interposer manual for more details. |
97160 | |
| Intel® FC-LGA4 processors (LGA775 - 775 lands), including
Intel® Pentium® Extreme / Pentium® D / Pentium®
4 / Pentium® 4 Extreme / Celeron® D / Core™2 Duo
/ Core™2 Quad / Core™2 Extreme processors. See the LGA Interposer manual for more details. |
97158 | |
| AMD® Athlon™ / Duron™ processors | 97136 | |
| Top-side Probe | ||
| Intel® Core™ i7 processors and Intel® Xeon® processor 5500 series - LGA1366 Top-side Probe. See the LGA1366 Top-side Probe manual for more details. |
206005 | |
| Adapters | ||
| ITP 700 Flex Adapter | contact us | |
| Intel® eXtended Debug Port (XDP) Adapter (full configuration details are available in Application Note #10) | 97192 |
PRIVACY STATEMENT | CONTACT US | SITE MAP | RESOURCES
2201 N. Central Expy., Ste 105, Richardson, TX 75080
(888) 694-6250 or (972) 437-2800
Copyright © 2001-2009 ASSET InterTech
Inc. All rights reserved.