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PROBLEM
BGA's give designers the capability to put even more functionality
into an even smaller area. However, when these designs flow through
the rest of the product development process, three problems typically
arise:
- Loss of Physical Access - Using
BGAs to carry signals means that there are no leads coming off
the chip or through the board. This makes physical access to
the device impossible.
- Solder Smearing - Assembling
boards with BGAs is much more difficult than previous packaging
technologies because the solder is so easily smeared. This leads
to structural, interconnect and functional problems.
- Test Points - To use traditional
testing methods, the designer is forced to bring out a large
number of test points -- which is in direct conflict with the
designer's goals to miniaturize the design.
SOLUTIONS
ASSET JTAG boundary-scan tools give back the access that BGAs
would otherwise take away. Test and design engineers can now access
and control the signals (inputs and outputs) of a BGA package.
Our customers have found that using a combination of the following
elements can solve BGA problems:
To
speak with an ASSET representative, click here.
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